Programme

Programme 2026

Day 1 – Monday 23rd of February

Time	Act
15:00 h	Exhibitor welcomed to booths
16:00 h	fotonica21 event (tbc)
19:00-21:00 h	Welcome reception

Day 2 – Tuesday 24th of February

Session	Time	Organization	Speaker	Title
Session 1 PIC Ecosystem presented by Prof. P. Muñoz	09:00-09:10 h	Universitat Politècnica de València	Pascual Muñoz	Opening
	09:10-09:30 h	secpho	Sergio Sáez	Applications of photonics: how PICs can help
	09:30-10:10 h	AESEMI	Sergio Vicente	Spanish semiconductor ecosystem
	10:10-10:30 h	fotonica21	Santiago Royo	Trends in EU research agenda, prospective for PICs
	10:30-11:00 h	EPIC	Carlos Lee	From Fab Capacity to Market Leadership: Strategic Challenges for European PICs
	11:00-11:30 h	Coffee break
Session 2 Participant company pills presented by Dr. G. Micó	11:30 - 11:40 h	EMEA Electro Solutions
	11:40 - 11:50 h	MicroWorld
	11:50 - 12:00h	FIBERCOM
	12:00 - 12:10h	MiCos Iberia
	12:10 - 12:20 h	NANOSCRIBE
	12:20 - 12:30 h	Finetech
	12:30 - 12:40 h	Suministro de Materiales y Asistencia (SMA)
	12:40 - 12:50 h	Heidelberg Instruments
	12:50 - 13:00 h	VLC Photonics
	13:00 - 13:10 h	ElectronMEC
	13:10 - 13:20 h	PHOTON EXPORT
	13:20 - 13:30 h	secpho
	13:30 h	secpho		Closing & intro to Business to Business meetings
	13:30-15:00 h	Lunch
Session 3 Chip Chairs Workforce presented by Prof. G. Carpintero	15:00-15:15 h	Universitat Politècnica de València	Demetrio Sartiano	PIC-UPV Industrial Chair, experience and outlook
	15:15-15:30 h	Universidad Politécnica de Madrid	Gonzalo Soldevilla	Photonic RF Phase Shifter
	15:30-15:45 h	Universitat Politècnica de Catalunya	Abel Juarez Padilla	Comparative study of nanofab techniques for gratings in LN wavveguides
	15:45-16:00 h	Universidad de Málaga	Jorge Rivas Fernandez	Transceptores para Free Space Optics, y de Biosensado fotónico
	16:00-16:15 h	Arquimea Research Center	José Carlos García Copete	TFLN capabilities for applications in intersatellite communications
	16:15-16:30 h	Universidade Vigo	David Álvarez	NEXTCHIP test and packaging
	16:30-16:45 h	Universidad Carloss III de Madrid	Jessica César Cuello	Assembly challenges: high frequency, materials & automation
	16:45-17:00 h	Round table	Mod. Guillermo Carpintero	Outlook to professional careers enabled by Cátedras Chip projects
	17:00-19:00 h	B2B meetings + Cleanroom and lab tours
	19:00-21:00 h	Networking dinner

Day 3 – Wednesday 25th of February

Session	Time	Organization	Speaker	Title
Session 4 PIXEurope presented by Dr. J. Pozo	09:00-09:20 h	Institut de Ciències Fotòniques	Valerio Pruneri	PIXEurope: technologies and open access
	09:20-09:50 h	IMB-CNM-CSIC	Joao Leite	Procurement and infrastructures
	09:50-10:10 h	Institut de Ciències Fotòniques	Armand Estevez	Design and demonstrators
	10:10-10:30 h	IMB-CNM-CSIC & UPV	Joaquín Faneca / Pascual Muñoz	Chip integration technologies, monolithic and hybrid
	10:30-10:50 h	Universidade Vigo / IMDEA	Roi Rouco / Guillermo Carpintero	Packaging and testing
	11:00-11:30 h	Coffee break
Session 5 PIXSpain Competence Center presented by Dr. Gloria Micó	11:30-11:50 h	Universitat Politècnica de València	Valentina Díaz Palacios	PIXSpain Competence Center
	11:50-12:10 h	Institut de Ciències Fotòniques	Marina Santana	EU ecosystem and pilot line
	12:10-12:40 h	Universidad de Málaga	Ana Sánchez Ramírez	Training catalogue
	12:40-13:10 h	IMB-CNM-CSIC	Jad Sabek	Technology catalogue
	13:10-13:20 h	Universitat Politècnica de València	Pascual Muñoz	Next actions: roadmap, funding & other
	13:20-13-30 h
	13:30-15:00 h	Lunch