PIW 2019 - Photonic integration week

14-15 January, 2019, Valencia (Spain)

Days

Hours

Mins

Seconds

Event Date

January 14-15, 2019

Event Location

Valencia (Spain)

The event

PIW brings together experts around photonic integration technologies for tele/datacom, sensing and bio-technology applications.

Why to join?

Great networking opportunity with a balanced mix of topics, sessions, social gathering and business to business meetings.

Meet the stakeholders

On this 3rd edition, while keeping the previously achieved mix of industry, research and academic speakers, the aim is to internationalize the event further.

1st Day January 14

2nd Day January 15

8:00 AM Registration Starts
09:00 h Opening
09:30 h Morning 1 – Photonic integration technologies and applications
12:30 h Business to business meetings 1
14:00 h Lunch
15:30 h Afternoon 1 – Tele and datacom
17:30 h Business to business meetings 2
19:00 h Welcome reception

Day 2 / 15th January 2019

8:00 AM Registration Starts
09:00 h Opening
09:30 h Morning 2 – Sensor technologies
12:30 h Business to business meetings 3
14:00 h Lunch
15:30 h Afternoon 2 – Bio technologies
18:00 h Closing

Martijn Heck

“PIC technologies for gas sensing” – Associate Professor in the Department of Engineering of Aarhus University.

Moritz Baier

“InP PICs for sensing” – Project Manager at Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute

Valery Tolstikhin

“Fabless PICs in InP Based on Taper-Assisted Vertical Integration Platform” – President and CEO at INTENGENT III-V Photonics Company.

Arne Leinse

“Silicon nitride photonic integrated circuits for life sciences” – Chief Commercial Officer at LioniX International.

Michael Geiselmann

“Non-linear photonics applications on a silicon nitride platform” – Co-founder and Managing Director at LIGENTEC SA.

Timo Aalto

“Photonics integration on silicon for sensing, imaging and communication” – Research Team Leader and silicon photonics pioneer at VTT.

Aitor Villafranca

“Polarization and mode handling building blocks on chip” – Postdoctoral Researcher (Juan de la Cierva grant) at Consejo Superior de Investigaciones Científicas and founder Alcyon Photonics.

Demetrio López

“Optical intersatellite communications” – Innovation Director at ALTER TECHNOLOGY GROUP.

Torsten Vahrenkamp

“Photonic device assembly and test solutions for the next generation integrated optics” – Owner, CEO, ficonTEC Service GmbH.

Josep Fàbrega

“Scalable spectrum/space aggregation for future agile high capacity metro fiber optic networks” – Senior Researcher at CTTC.

Robert Weih

“Laser technology for the mid-infrared and applications” – Head of Department Chip Development at nanoplus Nanosystems and Technologies GmbH.

Pere Pérez

“Ultrafast Fiber Lasers for Industry” – R+D Director at FYLA.

Joost van Kerkhof

“Automating packaging and assembly for hybrid photonic integration” – COO at PHIX Photonics-assembly.

Andrea Annoni

“Photonics packaging for Telecom, Aerospace, Defense and more” – Optical Engineer, Microtech Division, at CORDON ELECTRONICS.

Gunther Vollrath

“High throughput assembly of photonic devices” – CEO at AIFOTEC AG.