Youtube playlist
Programme Day 1 – 14th January 2019
08:00 hWelcome and registration
08:45 hOpeningPascual MuñozUniversitat Politècnica de ValènciaWelcome and event overview
09:00 hTele & datacomAntonio PastorTelefonicaQuantum key distribution: a telco operator perspective
09:30 hTele & datacomDemetrio LópezALTER Technology GroupOptical intersatellite communications
10:00 hTele & datacomJuan Pastor GraellsIndraPhotonics assisted EW technologies
10:30 hTele & datacomJosep Mª FábregaCTTCScalable spectrum/space transmission for future agile high capacity metro fiber optic networks
11:00 hCoffee break
11:30 hSensor technologiesArne LeinseLionix InternationalSilicon nitride photonic integrated circuits for life sciences
12:00 hSensor technologiesGermán VergaraNew Infrared TechnologiesUn-cooled MWIR imaging sensors: technology and applications
12:30 hSensor technologiesRobert WeihnanoPlus GmbHLaser technology for the mid-infrared and applications
13:30 hSensor technolgiesPim KatTechnobis groupCommercializing PIC technology for sensing
13:30 hLunch
14:30 hBusiness to business meetings 1
16:00 hPIC technologiesTimo AaltoVTT FinlandPhotonics integration on silicon for sensing, imaging and communication
16:30 hPIC technologiesIñigo ArtundoVLC PhotonicsFabless PICs in InP Based on Taper-Assisted Vertical Integration Platform
17:00 hPIC technologiesMichael GeiselmannLigentecNon-linear photonics applications on a silicon nitride platform
17:30 hPIC technologiesAitor VillafrancaCSIC / Alcyon PhotonicsPolarization and mode handling building blocks on chip
18:00 hBusiness to business meetings 2 / Lab tour / Clean room tour
19:30 hWelcome reception
21:00 hClosing
Programme Day 2 – 15th January 2019
08:00 hWelcome and registration
09:00 hPackaging, assembly & testIgnazio Piacentini ficontec Service GmbHPhotonic device assembly and test solutions for the next generation integrated optics
09:30 hPackaging, assembly & testGunther VollrathAifotec AGHigh throughput assembly of photonic devices
10:00 hPackaging, assembly & testAndrea AnnoniCordon Group / LinkraPhotonics packaging for Telecom, Aerospace, Defense and more
10:30 hPackaging, assembly & testJoost VankerkhofPHIX PAAutomating packaging and assembly for hybrid photonic integration
11:00 hCoffee break
11:30 hSensor technologiesPeter GoetzAIM PhotonicsAIM Photonics integrated technology for chemical and biological sensors
12:00 hSensor technologiesMartijn HeckAarhus UniversityPIC technologies for gas sensing
12:30 hSensor technologiesMoritz BaierFraunhofer HHIInP PICs for sensing
13:00 hSensor technologiesPere Pérez-MillánFYLAUltrafast Fiber Lasers for Industry
13:30 hClosing & Lunch
15:00 hBusiness to business meetings 3