Youtube playlist
1
/
5
PIW201901 - Welcome
PIW201902 - Quantum key distribution: a telco operator perspective
PIW201903 - Photonics assisted EW technologies
PIW201904 -Silicon nitride photonic integrated circuits for life sciences
1
/
5
Programme Day 1 – 14th January 2019
| TIME | SESSION | SPEAKER PROFILE | COMPANY / INSTITUTION | TALK |
|---|---|---|---|---|
| 08:00 h | Welcome and registration | |||
| 08:45 h | Opening | Pascual Muñoz | Universitat Politècnica de València | Welcome and event overview |
| 09:00 h | Tele & datacom | Antonio Pastor | Telefonica | Quantum key distribution: a telco operator perspective |
| 09:30 h | Tele & datacom | Demetrio López | ALTER Technology Group | Optical intersatellite communications |
| 10:00 h | Tele & datacom | Juan Pastor Graells | Indra | Photonics assisted EW technologies |
| 10:30 h | Tele & datacom | Josep Mª Fábrega | CTTC | Scalable spectrum/space transmission for future agile high capacity metro fiber optic networks |
| 11:00 h | Coffee break | |||
| 11:30 h | Sensor technologies | Arne Leinse | Lionix International | Silicon nitride photonic integrated circuits for life sciences |
| 12:00 h | Sensor technologies | Germán Vergara | New Infrared Technologies | Un-cooled MWIR imaging sensors: technology and applications |
| 12:30 h | Sensor technologies | Robert Weih | nanoPlus GmbH | Laser technology for the mid-infrared and applications |
| 13:30 h | Sensor technolgies | Pim Kat | Technobis group | Commercializing PIC technology for sensing |
| 13:30 h | Lunch | |||
| 14:30 h | Business to business meetings 1 | |||
| 16:00 h | PIC technologies | Timo Aalto | VTT Finland | Photonics integration on silicon for sensing, imaging and communication |
| 16:30 h | PIC technologies | Iñigo Artundo | VLC Photonics | Fabless PICs in InP Based on Taper-Assisted Vertical Integration Platform |
| 17:00 h | PIC technologies | Michael Geiselmann | Ligentec | Non-linear photonics applications on a silicon nitride platform |
| 17:30 h | PIC technologies | Aitor Villafranca | CSIC / Alcyon Photonics | Polarization and mode handling building blocks on chip |
| 18:00 h | Business to business meetings 2 / Lab tour / Clean room tour | |||
| 19:30 h | Welcome reception | |||
| 21:00 h | Closing | |||
Programme Day 2 – 15th January 2019
| TIME | SESSION | SPEAKER PROFILE | COMPANY / INSTITUTION | TALK |
|---|---|---|---|---|
| 08:00 h | Welcome and registration | |||
| 09:00 h | Packaging, assembly & test | Ignazio Piacentini | ficontec Service GmbH | Photonic device assembly and test solutions for the next generation integrated optics |
| 09:30 h | Packaging, assembly & test | Gunther Vollrath | Aifotec AG | High throughput assembly of photonic devices |
| 10:00 h | Packaging, assembly & test | Andrea Annoni | Cordon Group / Linkra | Photonics packaging for Telecom, Aerospace, Defense and more |
| 10:30 h | Packaging, assembly & test | Joost Vankerkhof | PHIX PA | Automating packaging and assembly for hybrid photonic integration |
| 11:00 h | Coffee break | |||
| 11:30 h | Sensor technologies | Peter Goetz | AIM Photonics | AIM Photonics integrated technology for chemical and biological sensors |
| 12:00 h | Sensor technologies | Martijn Heck | Aarhus University | PIC technologies for gas sensing |
| 12:30 h | Sensor technologies | Moritz Baier | Fraunhofer HHI | InP PICs for sensing |
| 13:00 h | Sensor technologies | Pere Pérez-Millán | FYLA | Ultrafast Fiber Lasers for Industry |
| 13:30 h | Closing & Lunch | |||
| 15:00 h | Business to business meetings 3 | |||