Networking at the heart, excellent talks in scene, we’re creating high expectations in this fourth edition of PIW 2020. Get registered soon! https://piw.webs.upv.es/index.php/registration/ Partner organizations: @secpho @vlcphotonics @fyla_laser @upvfab @LioniX_Int @EPICassoc @panasonic @uc3m @imec_int @ugent @ResearchUGent @PhotonicsUGent @ligentecpic @KTHuniversity @polimi @PHIX_Photonics @QuiXQuantum Read More
One more year we get support for the event from @secpho (Plantinum) @vlcphotonics (Gold) @FYLA_LASER (Silver) and @UPVfab (Bronze). Thanks all!
We’re happy to announce the sessions and speakers are ready! Please follow to https://piw.webs.upv.es/index.php/piw-2020-programme/ and don’t forget to register! https://piw.webs.upv.es/index.php/registration/
Alexandre Chikhaoui, Business Development Director at X-Celeprint, will present their technology to hybridize micro-fabrication technologies.
James Weber, Senior Business Development Manager at Panasonic Industry Europe GmbH @panasonic will be presenting one shot plasma wafer dicing technology and equipment.
We are pleased to announce the registration is open for the two day event PIW 2020, to be held in Valencia 13-14 January 2020. Please follow the link: https://piw.webs.upv.es/index.php/registration/ Thanks our confirmed sponsors: @SECPhO (Platinum), @VLCPhotonics (Gold) and @UPVfab (Bronze). Sponsorship opportunities: Read More
Nearly all speakers confirmed for PIW 2020, programme available soon! Curious about past editions programmes? Check our site Previous editions and do not miss our YouTube channel! Confirmed speakers at https://piw.webs.upv.es/
Guillermo Carpintero, Professor @UC3M Universidad Carlos III de Madrid, will present photonics technologies for terahertz applications.
Cosimo Calo, Research engineer at III-V Lab will share the perspective of an active semiconductor company towards hybrid integration with silicon nitride.
Michael Zervas, CEO and co-founder of LIGENTEC @LIGENTECPIC will present forthcoming developments on hybrid photonic integration of silicon nitride platforms with III-V semiconductors.