TIMESESSIONSPEAKER PROFILECOMPANY / INSTITUTIONTALK
08:00 hWelcome and registration
09:00 hPackaging, assembly & testIgnazio Piacentini ficontec Service GmbHPhotonic device assembly and test solutions for the next generation integrated optics
09:30 hPackaging, assembly & testGunther VollrathAifotec AGHigh throughput assembly of photonic devices
10:00 hPackaging, assembly & testAndrea AnnoniCordon Group / LinkraPhotonics packaging for Telecom, Aerospace, Defense and more
10:30 hPackaging, assembly & testJoost VankerkhofPHIX PAAutomating packaging and assembly for hybrid photonic integration
11:00 hCoffee break
11:30 hSensor technologiesPeter GoetzAIM PhotonicsAIM Photonics integrated technology for chemical and biological sensors
12:00 hSensor technologiesMartijn HeckAarhus UniversityPIC technologies for gas sensing
12:30 hSensor technologiesMoritz BaierFraunhofer HHIInP PICs for sensing
13:00 hSensor technologiesPere Pérez-MillánFYLAUltrafast Fiber Lasers for Industry
13:30 hClosing & Lunch
15:00 hBusiness to business meetings 3